Semiconductor Package Development

Premier Third-Party Semiconductor Packaging Development Support: Leveraging Over Two Decades of Innovation and Expertise

In the fast-paced and highly technical field of semiconductor manufacturing, the development of advanced packaging solutions is a critical component of product success. With over 20 years of experience in the industry, our Third-Party Semiconductor Packaging Development Support services offers unparalleled expertise, particularly in the area of System in Package (SiP) technologies. We are dedicated to helping you navigate the complexities of semiconductor packaging, from concept to production.

Why Choose Our Experienced Third-Party Service for Semiconductor Packaging Development?

Proven Expertise: With two decades in the semiconductor industry, our team brings a wealth of knowledge and experience. This extensive background is particularly valuable in developing innovative SiP solutions.
Objective Perspective: As an independent service provider, we offer unbiased support, ensuring that the solutions we develop are optimized for your specific needs and challenges, free from internal biases or constraints.
Advanced Technology Insights: Our long-standing experience in the industry means we have witnessed and contributed to the evolution of semiconductor packaging technologies. We bring this depth of insight to every project, ensuring cutting-edge solutions.
Customized Development Strategies: Recognizing the uniqueness of each client’s needs, we tailor our development strategies to align with your specific product goals and market demands, ensuring a bespoke solution that fits your requirements.
Risk Reduction: Our expertise helps in identifying and mitigating potential design and production risks early in the development process, saving time and resources and enhancing the overall reliability of the final product.
Speed to Market: Leveraging our extensive experience, we streamline the development process, helping you bring your products to market faster without compromising on quality or performance.
Comprehensive Support: From initial design to final production, we offer end-to-end support, covering all aspects of semiconductor packaging development, including material selection, design optimization, and testing.
Knowledge Transfer: We believe in empowering our clients. Alongside our development support, we provide knowledge transfer and training, ensuring your team is equipped with the latest insights and skills in semiconductor packaging technology.

Custom Package Design & Development

Elevating Beyond the Conventional
In the intricate world of Semiconductor devices, the value of advanced package design is often overshadowed by its basic function to form a bridge between the Die and the PCB. Yet, the scope of packaging extends far beyond this traditional role.
We recognize the package as a pivotal component of the semiconductor’s structural architecture, one that introduces additional functionality and reliability into the final product.

Expanding Horizons with Innovative Design

Imagine the synergy between an engine and its chassis in automotive development; similarly, in the semiconductor realm, the Die (engine) and the Package (chassis) work in unison yet possess untapped potential for individual enhancement. This perspective opens up avenues for progressive development and refinement.

CONSIDER

Introduction of MEMS Elements – By integrating Micro-Electro-Mechanical Systems (MEMS) into the package design, unlock additional functionalities while minimizing the need for extensive PCB components.
Additional ESD protection – Elevating the package design includes fortifying electronic devices against electrostatic discharges, thereby bolstering the product’s durability and longevity.
Switching to Bumped connections to improve reliability, shorten connections and reduce cost.
Die and Component Stacking: A strategic approach to reducing size and cost, stacking die and components within a hermetically sealed block improves reliability and consolidates the product into a more efficient package.

These low-risk developments represent a strategic move towards simplification, cost reduction, and enhanced reliability. By redefining package design, Semicons-Global not only mitigates manufacturing challenges but are more compact & resilient, reducing the PCB BOM and consolidate costs.

Packaging Process Development

In a market where product design and development cycles are rapidly shrinking, Customers are demanding a constant stream of advancements and we understand the need for a dynamic development roadmap that keeps offerings at the cutting edge.
Our expertise in semiconductor packaging enable us to delve deep into the potential of your designs, processes, and requirements and our objective third party stance empowers you to craft and deliver a strategic plan that is both thoughtful and robust, aligning your suppliers’ capabilities with your customers’ evolving needs.
Whether you need a short term evaluation or long term strategy, we are able to support your direction with considered objective approach.

System in Package (SiP)

Over the last 15 years have introduced a number of different size Custom SiP devices with different MEMS and functional chips, utilising Cavity, Flip chip and stacked die methods to supply volume production close to a billion devices to the automotive market .
Require a Heterogeneous integrated Custom package and need someone to support Feasibility, Design, Development and Introduction.

Package Assembly Supplier Management

Developing a cost effective continuous improvement approach with the ability to commit and react to forecast fluctuations is essential and critical to meeting Customer expectation and business success. Our Third-Party Supplier Management services are specifically tailored to work with your unique needs whilst emphasizing the development of a proactive relationship.

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